| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and the manufacturing method with which a semiconductor element is sufficiently cooled, electric resistance is reduced, high density mounting is realized and assembly man-hours are reduced. SOLUTION: The semiconductor device is provided with a tape wiring board 12, the semiconductor elements 15 and 16 loaded on one main surface of the tape wiring board, a solder ball or bump electrode 13 electrically connected to the prescribed part of one main surface of the tape wiring board provided with the semiconductor elements and provided on the other main surface side of the tape wiring board, and a hollow pipe-like base body 11. The tape wiring board 12 is wound to the hollow pipe-like base body 11. |
