ADHESIVE TAPE/SHEET FOR CARRYING SEMICONDUCTOR CHIP, SEMICONDUCTOR CHIP CARRIER, METHOD FOR MOUNTING THE SEMICONDUCTOR CHIP AND SEMICONDUCTOR CHIP PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide an adhesive tape and sheet for carrying a semiconductor chip, capable of improving the yield of the chip with, an adhesive and preventing the adhesive from being used wastefully. SOLUTION: A plurality of adhesives parts 12 for adhering the semiconductor chips 2 in a shape which is substantially the same as the chip 2 to be adhered or slightly large than the chip 2 to be adhered intermittently in the longitudinal direction of a tape-like base 11 on the base 11. The adhesive for constituting the adhesive parts 12 exhibit stepwise adhesive properties.