| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder plating ball, which can be manufactured without limit of a size of a difference of a standard single electrode potential, and to provide a method for manufacturing a semiconductor connecting structure, using such a solder ball. SOLUTION: The solder plating ball comprises a ball-like core 10 made of a first metal material, at least one first plating layer 12 which is provided so as to surround the core and made of a second metal material, and at least one second plating layer 14 provided to surround the core and made of a third metal material. The first, second and third metal materials are each of material for constituting the solder.
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