| 摘要 |
PROBLEM TO BE SOLVED: To improve working efficiency by performing integrated works for each process with rewinding an adhesive tape for die-mounting rolled in a reel shape as it is and to provide a method for manufacturing a thin-type RFID label with fully protecting a wire from outside force by removing protrusion of a wire bonding part. SOLUTION: A strip shaped antenna base material 2 and semiconductor chip 2 are adhered to a surface of the adhesive tape for die-mounting 1 rolled in a reel shape with rewinding the tape 1 starting from its end, and the wire 4 such as a gold wire is bonded between an electrode terminal of the chip 3 and the material 2. Then the bonded part of the wire is crushed for removing the protrusion and liquid resin 5 is dropped on the surface and cured and additionally a protection tape 6 is adhered to the surface and wound in a reel shape. Such a series of processes is integrally performed with conveying the tape 1 at a constant speed or intermittently. |
