INSULATING MATERIAL RESIN COMPOSITE AND INSULATING MATERIAL USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an insulating material resin composite that maintains an excellent thermal resistance and can realize a low dielectric constant for the usage of semiconductor, and an insulating material using the same. SOLUTION: In the insulating material resin composite which has as an essential content an organic compound (A) and a thermo-hardening polybenzooxazol precursor (B) that has a repeating unit as expressed in the formula (1-1) or the like and has at least one of an acetylene structure or a biphenyl structure, a resin that has made cyclization or cross-linking of the thermo-hardening polybenzooxazol precursor (B) has a glass transition temperature which is higher than the thermal decomposition temperature or sublimation temperature of the organic compound (A).