The invention provides a small and reliable pressure sensor having a smaller number of components. A sensor unit (11) molded with resin includes a semiconductor chip (1) for converting the change in pressure of a medium through a hole into an electric signal. A lead material (12) connected electrically with the sensor unit (11) has one end exposed to a connector (23). Pressure is applied to the semiconductor chip (11) through a pipe (30). An outer case (21) is formed of resin by insert molding using the sensor unit (11), the lead material (12) and the pipe (30).
