发明名称 |
Matrix form semiconductor package substrate having an electrode of serpentine shape and method for forming |
摘要 |
A matrix form semiconductor package substrate that has an electrode situated in-between a plurality of IC package substrates for providing electrical communication to conductive pads on the substrate is provided. The matrix form semiconductor package substrate includes a plurality of IC package substrates that are integrally formed on a strip in a matrix pattern that has a boundary between each two of the plurality of IC package substrates. Each of the plurality of IC package substrates has a multiplicity of conductive pad traces and an electrode, or a plating bar, formed in a serpentine configuration along the boundary for providing electrical communication to the multiplicity of conductive pads.
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申请公布号 |
US2002145178(A1) |
申请公布日期 |
2002.10.10 |
申请号 |
US20010827106 |
申请日期 |
2001.04.05 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
TSAO PEI-HAW;HUANG CHENDER;WANG CHUNG-YU |
分类号 |
H01L21/48;H01L23/498;H05K3/00;H05K3/24;(IPC1-7):H01L23/544 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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