发明名称 |
THREE-DIMENSIONAL METAL DEVICES HIGHLY SUSPENDED ABOVE SEMICONDUCTOR SUBSTRATE, THEIR CIRCUIT MODEL, AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
Disclosed are a three dimensional metal device floated over a semiconductor substrate, a circuit thereof, and a manufacturing method thereof. A passive electric device for wireless communications and optical communications, such as a spiral inductor, a solenoid inductor, a spiral transformer, a solenoid transformer, a micro mirror, a transmission line is floated over and apart by a few ten micrometers from the semiconductor substrate. These three dimensional metal devices remarkably decrease a signal loss to the substrate, to thereby enhance the device performance, to allow a modeling of a device separated from the substrate, and to make it possible to form an integrated circuit below the device. Further, the three dimensional metal device is manufactured in a monolithic method on the integrated circuit such that it does not affect on the integrated circuit formed therebelow. |
申请公布号 |
WO02080279(A1) |
申请公布日期 |
2002.10.10 |
申请号 |
WO2001KR02260 |
申请日期 |
2001.12.26 |
申请人 |
KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY;YOON, JUN-BO;YOON, EUISIK;KIM, CHOONG-KI;HAN, CHUL-HI |
发明人 |
YOON, JUN-BO;YOON, EUISIK;KIM, CHOONG-KI;HAN, CHUL-HI |
分类号 |
H01L21/822;H01L23/522;H01L23/66;H01L27/04;H01L27/08;H01L29/00;H05K3/40 |
主分类号 |
H01L21/822 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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