发明名称 PLASMA PROCESSING DEVICE
摘要 In a microwave plasma-processing device, a shower plate or plasma penetration window opposed to a board to be processed is recessed on the side opposed to the board to be processed, whereby a decrease in plasma density in the peripheral region of the board to be processed is compensated. As a result, even when plasma processing at low pressure, such as etching, is effected, stabilized uniform plasma is maintained in the vicinity of the surface of the board to be processed. Further, such arrangement enhances ignition of plasma.
申请公布号 WO02080252(A1) 申请公布日期 2002.10.10
申请号 WO2002JP03111 申请日期 2002.03.28
申请人 OHMI, TADAHIRO;TOKYO ELECTRON LIMITED;HIRAYAMA, MASAKI;SUGAWA, SHIGETOSHI;GOTO, TETSUYA 发明人 OHMI, TADAHIRO;HIRAYAMA, MASAKI;SUGAWA, SHIGETOSHI;GOTO, TETSUYA
分类号 H05H1/46;B01J19/08;C23C16/511;H01J37/32;H01L21/205;H01L21/302;H01L21/3065;(IPC1-7):H01L21/31;H01L21/306 主分类号 H05H1/46
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