发明名称 |
Electrically-conductive, thermally-insulating structure and method |
摘要 |
An electrically-conductive, thermally-insulating structure includes a thermally-insulating layer having a thermal conductivity of no more than about 3.5x10-3 W/hr.cm.° K and an electrically-conductive layer, applied to the thermally-insulating layer, which has an electrical resistivity of no more than about five ohms at 700° C. The thermally-insulating layer can comprise a plurality of microballoons to decrease the density of the thermally-insulating layer.
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申请公布号 |
US2002144836(A1) |
申请公布日期 |
2002.10.10 |
申请号 |
US20020050095 |
申请日期 |
2002.01.15 |
申请人 |
LOCKHEED MARTIN CORPORATION |
发明人 |
HUNN DAVID L.;BARTOS BARRY W. |
分类号 |
B64C1/38;B64C1/40;C23C4/02;C23C28/00;(IPC1-7):H01B7/18 |
主分类号 |
B64C1/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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