发明名称 |
Method and structure for economical high density chip carrier |
摘要 |
A flip-chip joinable substrate having non-plated-on contact pads and a method for making the same. The substrate has an external metal foil layer upon a dielectric layer upon a patterned internal metal layer having an internal contact area. An area of the external metal foil layer above the internal contact area is selected. A microvia cavity extending to the internal contact area is perforated centrally within the selected area and is filled with a mass of conductive paste forming an external contact pad. The external contact pad is used as an etch mask for removing the adjacent external metal foil.
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申请公布号 |
US2002145203(A1) |
申请公布日期 |
2002.10.10 |
申请号 |
US20010827014 |
申请日期 |
2001.04.05 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ADAE-AMOAKOH SYLVIA;KRESGE JOHN S.;MARKOVICH VOYA R.;YOUNGS THURSTON B. |
分类号 |
H01L21/48;H01L23/498;H05K1/11;H05K3/06;H05K3/24;H05K3/34;H05K3/40;H05K3/46;(IPC1-7):H01L29/40;H01L21/44 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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