| 摘要 |
<p>In a method of forming connectors on a substrate (202), a first patterning layer (200), being made up of mesh screen (204) and resist (206) to define a plurality of openings (208, 210, 212, 214) therein, is provided on the surface of the substrate (202), and the openings are filled with solder paste (280). A second patterning layer, also made up of a mesh screen (252) and resist (254) to define a plurality of openings (256, 258, 260, 262) therein, is provided over the first patterning layer (200), with the openings of the second patterning layer (250) communicating with respective openings of the first patterning layer. The communicating openings form passages (270, 274, 276, 278) through the patterning structure (272), with some of the passages bieng of different volume from others. After filling of the openings of the second patterning layer (250) with solder paste (280), the patterning layers (200, 250) are removed, leaving bodies of solder paste which vary in volume in accordance with the different volumes of the passages (270, 274, 276, 278).</p> |
