发明名称 |
Coils for generating a plasma and for sputtering |
摘要 |
A sputtering coil for a plasma chamber in a semiconductor fabrication system is provided. The sputtering coil couples energy into a plasma and also provides a source of sputtering material to be sputtered onto a workpiece from the coil to supplement material being sputtered from a target onto the workpiece. Alternatively a plurality of coils may be provided, one primarily for coupling energy into the plasma and the other primarily for providing a supplemental source of sputtering material to be sputtered on the workpiece.
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申请公布号 |
US2002144901(A1) |
申请公布日期 |
2002.10.10 |
申请号 |
US20020052951 |
申请日期 |
2002.01.17 |
申请人 |
NULMAN JAIM;EDELSTEIN SERGIO;SUBRAMANI MANI;XU ZHENG;GRUNES HOWARD;TEPMAN AVI;FORSTER JOHN;GOPALRAJA PRABURAM |
发明人 |
NULMAN JAIM;EDELSTEIN SERGIO;SUBRAMANI MANI;XU ZHENG;GRUNES HOWARD;TEPMAN AVI;FORSTER JOHN;GOPALRAJA PRABURAM |
分类号 |
C23C14/34;H01J37/34;H01L21/203;(IPC1-7):C23C14/34 |
主分类号 |
C23C14/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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