METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE OBTAINED BY MEANS OF SAID METHOD

摘要

The invention relates to the manufacture of a semiconductor device (10) which is suitable for surface mounting of a semiconductor body (1) provided with connection regions (2) for, for example, a diode. The body (1) is attached to an electrically insulating medium (3), which is provided, on (at least) one of its sides, with a conductor pattern (4) which is suitable for surface mounting. The body is attached to the other side of the medium (3), and the connection regions (2) of the diode are connected to the conductor pattern (4) through conducting vias (5) in the medium (3). In a method in accordance with the invention, the medium (3) provided with the conductor pattern is formed by a flexible foil (6) which comprises a conductive layer (4) and an insulating layer (3), and which is detachably secured, on the side of the conductor pattern (4) formed in the conducting layer (4), to a substrate (7). Such a method enables a very compact surface-mountable device (10) to be obtained in an economical way. The foil (6) preferably comprises a polyimide layer (3) and a copper layer (4).