POROUS PARA-ORIENTED AROMATIC POLYAMIDE FILM, ITS PREPREG AND SUBSTRATE USING PREPREG AND USED FOR PRINTED CIRCUIT

摘要

PROBLEM TO BE SOLVED: To provide a porous para-aromatic polyamide film with a light weight and a low thermal linear expansion coefficient which are the characteristics of a para-aramid, and having large tear-spreading resistance, to provide a method for producing the film, to provide a prepreg prepared by impregnating the film with a thermoplastic resin and/or a thermosetting resin, and to provide a substrate using the prepreg and used for a printed circuit. SOLUTION: This porous para-aromatic polyamide film comprises 100 pts.wt. of a para-aromatic polyamide and 10 to 400 pts.wt. of fine particles comprising a heat-resistant resin, and has a thermal linear expansion coefficient of <=±50×10<-6> / deg.C at 200 to 300 deg.C. The method for producing the film. The prepreg produced by impregnated the film with a thermoplastic resin and/or a thermosetting resin. The substrate using the prepreg and used for a printed circuit.