| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyamide resin suitable for molding as an electric or electronic part, an automotive part, and having excellent moldability, low absorptivity of water, chemical resistance, strength characteristics and heat resistance, and to provide a polyamide composition and a molded product thereof. SOLUTION: This polyamide resin is characterized in that the resin comprises (a) a diamine component containing 50-100 mol% 1,10-diaminodecane, and (b) a dicarboxylic acid component comprising 50-100 mol% terephthalic acid component unit, 0-50 mol% aromatic dicarboxylic acid component unit except the terephthalic acid, and/or 0-50 mol% 4-20C aliphatic dicarboxylic acid component unit. The polyamide resin has the excellent moldability, the low absorptivity of the water, the chemical resistance, the strength characteristics and the heat resistance, and is suitable for the molding material for the electric or electronic part, the automotive part or the like. The molded product using the resin has the low water absorptivity, and having excellent heat resistance in a reflow step. |
