发明名称 MOLD FOR MOLDING PLASTIC PART, METHOD FOR MOLDING PLASTIC PART USING THE MOLD, AND METHOD FOR CLEANING MOLD FOR MOLDING PLASTIC PART
摘要 PROBLEM TO BE SOLVED: To provide a cleaning technique which materializes a high degree of cleanliness with a low consumption of energy to solve the problem that although the quality and yield of a plastic part depend on the degree of cleaning of a mold, large amounts of pure water and energy have been required to accomplish the cleaning of the surface of the mold. SOLUTION: The mold for molding a plastic part in which a photocatalyst layer is arranged completely or partially on its surface is used.
申请公布号 JP2002292636(A) 申请公布日期 2002.10.09
申请号 JP20010103500 申请日期 2001.04.02
申请人 SEIKO EPSON CORP 发明人 KASAI YOSHIHIKO
分类号 G02B3/00;B01J35/02;B29C33/38;B29C33/72;(IPC1-7):B29C33/38 主分类号 G02B3/00
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