| 摘要 |
PROBLEM TO BE SOLVED: To provide a Cu-Cr-Sn based high strength and highly conductive copper alloy which has good bending workability and thermal peeling resistance of solder, further has low burrs in the blanked end edges and excellent press blanking properties, and has excellent Ag plating properties and etching workability. SOLUTION: The high strength and highly conductive copper alloy has a composition containing, by mass, 0.05 to 0.6% Cr, 0.05 to 0.6% Sn, 0.05 to 0.6% Zn, 0.0001 to 0.01% B, 0.0001 to 0.02% C, 0.0003 to 0.005% S and 0.00001 to 0.001% Se, and the balance Cu with inevitable impurities, and has a crystal grain size of <=30μm. The ratio of the number of precipitates having a grain size of <=0.1 m to the number of all precipitates is >=98%. |
