发明名称 |
Semiconductor wafer having a bank on a scribe line |
摘要 |
A semiconductor wafer includes a plurality of chips arranged in a matrix and a plurality of scribe lines separating the chips from one another. A polyimide overcoat film covering each chip except for electrode pads of the chip has a bank crossing the scribe line for preventing the ground particles generated by grinding the bottom surface of the wafer from entering the chip along the scribe lines.
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申请公布号 |
US6462401(B2) |
申请公布日期 |
2002.10.08 |
申请号 |
US20010816229 |
申请日期 |
2001.03.26 |
申请人 |
NEC CORPORATION |
发明人 |
FUJII MOYURU |
分类号 |
H01L21/304;H01L21/301;H01L21/78;H01L23/31;(IPC1-7):H01L23/544 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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