| 摘要 |
A multichip module mainly comprises a first chip disposed on the upper surface of a substrate by wire bonding and a second chip disposed on the lower surface of the substrate by flip-chip bonding wherein the first chip and the second chip are of the same type. The upper surface of the substrate is provided with a plurality of wire bondable pads for electrical connecting to the first chip. The lower surface of the substrate is provided with a plurality of flip-chip pads for electrical connecting to the second chip. According to the present invention, the first and second chips are both oriented face up (with their bonding pads up with respect to the substrate) for bonding to the substrate. Thus, address assignment of the bonding pads on the two semiconductor chips conforms to each other. Consequently, circuit layout on the upper and lower surfaces of the substrate can use substantially the same design wherein common conductive traces on the upper and lower surfaces of the substrate are electrically connected by plated through holes. |
