发明名称 |
Composition for positive photoresist |
摘要 |
A photoresist composition is provided. The photoresist composition includes a polymer resin for forming a photoresist layer, a photosensitive chemical for changing solubility of the photoresist layer when exposed to some form of radiation, and 3-methoxybutyl acetate, 2-heptanone, and 4-butyrolactone as a solvent. The composition has a good photosensitivity and remainder ratio, and no unpleasant odor.
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申请公布号 |
US6461785(B1) |
申请公布日期 |
2002.10.08 |
申请号 |
US20000651114 |
申请日期 |
2000.08.30 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JU JIN-HO;LEE YU-KYUNG;PARK HONG-SIK;NAH YUN-JUNG;KIM KI-SOO;KANG SUNG-CHUL |
分类号 |
C08K5/28;C08L61/10;G03F7/004;G03F7/022;G03F7/023;H01L21/027;(IPC1-7):G03F7/023 |
主分类号 |
C08K5/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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