| 摘要 |
A testing system is used for diagnosing a semiconductor device, and includes a testing apparatus for supplying an input test signal and receiving an output signal, a socket having plural pairs of contact leaves for nipping solder balls of the semiconductor device therein and a wiring board connected between the testing apparatus and the plural pairs of contact leaves, wherein the contact leaves of each pair are electrically isolated from each other so that a transmission line for the input test signal is only short circuited with a transmission line for the output signal at associated one of the solder balls, thereby permitting the solder balls to serve as neutral points in the dual transmission lines.
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