| 摘要 |
A component alignment casing system for connecting circuits, and a method for making or assembling the component alignment casing system is disclosed. The system has at least one surface mountable component which has a plurality of exposed leads, a prepared component which has a plurality of exposed traces, an alignment base onto which the prepared component and the surface mountable component are laid, and a compressive cover that attaches to said alignment base. The alignment base has a plurality of alignment ribs to isolate and align the exposed traces of the prepared component. The prepared component and surface mountable components are electrically connected and attached together, preferably by soldering. The method comprises laying the prepared component on the alignment base and ribs, and overlaying the surface mountable component, with its exposed leads, on to the alignment base and the prepared component, and electrically connecting the components together, preferably by soldering, to the alignment base. The cover is then snapped on, and supplies compressive force to assure good contact between the leads of the surface mountable component and the traces of the prepared component.
|
