| 摘要 |
PROBLEM TO BE SOLVED: To improve the accuracy of the relative position of a following process to the position of its preceding process in the manufacture of a multilayer printed wiring board. SOLUTION: In the manufacturing method of the multilayer printed wiring board, a through hole is formed in a core board and inner-layer conductor patterns are formed on the core board by using the through hole as a positional reference. Then, an insulation layer is formed on the surface of the core board, and an insulation material is filled partly or wholly into the through hole. Subsequently, via holes are formed in the insulation layer by using as a positional reference a guide mark formed together with the inner-layer conductor patterns, and a new through bole 24 whose sectional area in the parallel direction with the core board is smaller than the one of the original through hole is formed in the inside of the original through by removing a portion of the insulation material filled into the original through hole. Thereafter, outer-layer conductor patterns are formed on the core board by using the new through hole 24 as a positional reference. |
