| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board manufacturing method of forming wiring circuit layers through a transfer method and improving them in position accuracy while they are laminated. SOLUTION: This manufacturing method comprises a first process (a) of forming a first and a second positioning mark, 5a and 5b at different positions located at the peripheral part of a thermosetting resin-containing insulating sheet 1; a second process (b) of forming a wiring circuit layer 7 of metal foil on the surface of a transfer sheet 6; a third process (c) of positioning the wiring circuit layer 7 formed on the transfer sheet 6 by the first positioning mark 5a, laminating it on the insulating sheet 1, bonding them together by application of pressure, and then separating the transfer sheet 6 so as to transfer the wiring circuit layer 7 on the surface of the insulating sheet 1; and a fourth process (d) of positioning a plurality of wiring sheets (a), (b) and (c) on which the wiring circuit layers 7 are formed by the use of the second positioning mark 5b, laminating them together, and then thermosetting the laminate. |
