发明名称 ELECTRONIC EQUIPMENT HAVING HEAT SINK
摘要 PROBLEM TO BE SOLVED: To mount a heat sink to an electronic component side in a press state without carrying out screwing work. SOLUTION: An elastic piece 3 7 is formed in one piece on a terminal block 7 for retaining a terminal pin 6. As a result, utilizing the elastic piece 37 on the terminal block 7 allows the end section of the heat sink 9 to be mounted while the end section is being retained without carrying out the screwing work. At this time, the heat sink 9 is pressed to the side of the heat generation component 3 by engaging to the elastic piece 37, thus securely conducting heat from the heat generation component 3 to the heat sink 9.
申请公布号 JP2002290089(A) 申请公布日期 2002.10.04
申请号 JP20010088522 申请日期 2001.03.26
申请人 DENSEI LAMBDA KK 发明人 URATA HIKARI
分类号 H01R9/00;H01R9/16;H05K7/20;(IPC1-7):H05K7/20 主分类号 H01R9/00
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