HEAT TREATMENT DEVICE AND HEAT TREATMENT METHOD

摘要

PROBLEM TO BE SOLVED: To provide a heat treatment device and a heat treatment method by which a reaction product is restrained from attaching to a lid body. SOLUTION: A reaction chamber in the heat treatment device 1 is composed of a reaction pipe 2, a manifold 5 and a movable lid body 7. Semiconductor wafers are stored in the reaction chamber by moving the lid body 7 until it contacts the manifold 5 and the reaction chamber becomes airtight. In a state of the lid body 7 contacting the manifold 5, a heater 12 for the lid body is located in the vicinity of the lid body 7 inside the reaction chamber. The heater 12 for the lid body is configured so as to enable to heat the lid body 7 to a predetermined temperature.