发明名称 Electroconductive composition and electroconductive film forming method
摘要 An electroconductive composition including a mixture of a copper powder having an averaged particle size between 0.3 and 20 μm and a copper fine powder having an averaged particle size between 1 and 50 nm; a solvent comprising a multivalent alcohol, such as ethylene glycol or diethylene glycol, having two or more OH groups; and an additive comprising a compound such as malic acid or citric acid having two or more COOH groups and one or more OH groups where the number of COOH groups is equal to or greater than the number of OH groups.
申请公布号 US7976732(B2) 申请公布日期 2011.07.12
申请号 US20070727251 申请日期 2007.03.26
申请人 SUMITOMO METAL MINING CO., LTD. 发明人 KAMADA KEIJI;MORI KENSAKU
分类号 H01B1/00 主分类号 H01B1/00
代理机构 代理人
主权项
地址