| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermal treatment device capable of decreasing promptly temperatures of a thermal treatment plate down to a setting temperature without exerting adverse influences on treatment results of a substrate. SOLUTION: A thermal treatment device comprises a thermal treatment plate 11 which adopts a heat pipe structure; a heater 17 for heating an operating liquid 16; and a cooling plate 21 for decreasing temperatures of the thermal treatment plate 11. When decreasing the temperature of the thermal treatment plate 11, a coolant is supplied from a supply part 32 of the coolant to the cooling plate 21, and the thermal treatment plate 11 is decreased in temperatures at a high speed. Next, a compressed air is supplied from a supply part 31 of the compressed air to the cooling plate 21, and the thermal treatment plate is decreased in temperatures at a low speed.
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