发明名称 METHOD FOR FABRICATING ELECTROSTATIC CHUCK ADHERING DIELECTRIC LAYER DIRECTLY
摘要 PURPOSE: A method for fabricating an electrostatic chuck adhering a dielectric layer directly is provided to apply the dielectric layer on a ceramic substrate without using an adhesive. CONSTITUTION: An electrode layer is formed on a ceramic substrate. A sintering process is performed. A slurry is formed by milling crystalline glass powder fabricated with a calcium oxide, alumina, silica, and a boron oxide. Air bubbles are removed from the slurry. The slurry is cast on the ceramic substrate by a tape. A dielectric layer is formed by drying the slurry. The dielectric layer and the electrode layer are sintered. The crystalline glass powder is formed with the calcium oxide of 33 weight percents, alumina of 17 weight percents, silica of 40 weight percents, and the boron oxide of 10 weight percents.
申请公布号 KR20020074961(A) 申请公布日期 2002.10.04
申请号 KR20010015078 申请日期 2001.03.23
申请人 BANG, JAE CHEOL;HANJOO IND. CO., LTD.;HOSEO 发明人 BANG, JAE CHEOL
分类号 H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/68
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