| 摘要 |
PROBLEM TO BE SOLVED: To provide a forming method for a bump which has a high height and uniformity. SOLUTION: A thick photoresist which has a plurality of openings is formed on a wafer so that a bonding pad is exposed. Soldering paste is filled into the openings of the thick photoresist. A stencil, which has a plurality of openings conforming to the photoresist openings, is applied on the wafer. After removing the stencil, the bump is formed by performing a reflow process. Next, the thick photoresist is removed. As the bump is formed through two steps using the thick photoresist and the stencil, the higher and more uniform bump can be obtained after the reflow. |
