发明名称 SURFACE ACOUSTIC WAVE DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an inexpensive surface acoustic wave device, of high performance characteristics. SOLUTION: The device is provided with an electromagnetic shielding layer 8, which is made is a conductive organic polymer, grounded via a flat shape or vessel shape package base member 1 so as to cover a surface acoustic wave element 6, which is electrically connected to the package base member 1; and the device is also provided with an electrical insulating layer 7 which is made of an organic polymer and arranged between the electromagnetic shielding layer 8 and the surface acoustic wave element 6 for preventing short-circuiting between the signal line of the surface acoustic wave element 6 and a cable way which forms the ground. Or the device is provided with the conductive organic polymer-made electromagnetic shielding layer 8 directly on the surface acoustic wave element, which is arranged on the vessel shape package base member 1 leaving a small gap.
申请公布号 JP2002290199(A) 申请公布日期 2002.10.04
申请号 JP20010093814 申请日期 2001.03.28
申请人 MITSUBISHI ELECTRIC CORP 发明人 TANAKA HIROSHI
分类号 H03H9/25;(IPC1-7):H03H9/25 主分类号 H03H9/25
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