PIN STANDING RESIN SUBSTRATE, METHOD FOR MANUFACTURING PIN STANDING RESIN SUBSTRATE, PIN AND METHOD FOR MANUFACTURING PIN

摘要

PROBLEM TO BE SOLVED: To provide a pin standing resin substrate where a pin is hard to be broken even if stressed, a method for manufacturing the pin standing resin substrate, the pin for the pin standing substrate, and a method for manufacturing the pin. SOLUTION: The pin standing resin substrate 11 comprises a resin substrate 13 having a pin pad 17AP that is composed of resin or the like and exposed in a main plane 13A and many pins 1 bonded to the pin pad 17AP with solder HD. The pin 1 is subjected to heat treatment to heat it to 600-900 deg.C. In addition, the pin 1 has rod-like part 1A and a large diameter part 1B including the spherical surface that balloons in the direction opposite to this rod-like part 1A. The large diameter part 1B or the like is soldered to the pin pad 17AP.