发明名称 EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin composition which is excellent in crack resistance and adhesion. SOLUTION: The epoxy resin composition comprises an epoxy resin (A), a curing agent (B), a filler (C), and a curing accelerator (D) as the indispensable components, wherein the epoxy resin (A) contains a bifunctional epoxy compound at a rate of 80% by weight or more; the curing agent (B) contains at least one kind of bifunctional phenol curing agents represented by formula (I) or (II) at a rate of 1-70% by weight; the filler (C) contains a spherical silica at a rate of 80% by weight or more; and the resin composition contains the filler (C) at a rate of 80-96% by weight relative to the total.
申请公布号 JP2002284856(A) 申请公布日期 2002.10.03
申请号 JP20010088561 申请日期 2001.03.26
申请人 TORAY IND INC 发明人 TANAKA AKIKO;SHIMIZU MICHIO;HONDA SHIRO
分类号 C08K3/36;C08G59/24;C08G59/62;C08L63/00;H01L23/29;H01L23/31;(IPC1-7):C08G59/62 主分类号 C08K3/36
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