| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for cutting out one or more pieces of single cells from a sheet of resin substrate type liquid crystal cells with a CO2 laser so as not to contaminate the inside of the liquid crystal cell with any molten material remaining attached to a liquid crystal injection hole part 12. SOLUTION: In a process for manufacturing a sheet of the resin substrate type liquid crystal cells, immediately after a display pattern forming step, a hollowed out part 11 with a previously specified dimension is provided in a region designed to be a liquid crystal injection hole along a substrate cutting line. Furthermore, immediately after formation of the hollowed out part 11, the molten material remaining on and around a cutting plane for the hollowed out part 11 is completely removed with cleaning treatment. Subsequently the resin substrate provided with the hollowed out part 11 is used for the following steps of the display pattern forming step so as to turn it into a sheet of the resin substrate type liquid crystal cell.
|
