RESIN COMPOSITION FOR MOLDING

摘要

PROBLEM TO BE SOLVED: To provide an IC molding resin composition which inhibits the corrosion of an ITO electrode to be caused by the connecting members for mounting IC chips. SOLUTION: The IC molding resin composition comprises (a) a radically polymerizable liquid resin, (b) a radical generation catalyst, and (c) an organic carboxylic acid to be represented by the formula: R-COOH (wherein R is a 4-20C straight-chain or branched alkyl group).