发明名称 Electronic packages
摘要 A high frequency electronic package (500) having a metal housing (504) and a high frequency electronic component, such as a laser diode, contained within the metal housing (504). One or more leads (508, 510, 512, 514) pass into the metal housing through a header (506) and are coupled to the high frequency electronic component. The leads, metal housing and components within the housing cause stray inductances and capacitances, which cause problems in matching and driving the high frequency electronic component. Therefore a high value capacitor (502) is coupled between the metal housing and an anode lead, as close to the anode as possible, to short the stray capacitances at high frequencies. The capacitor can be a ring capacitor positioned over the anode lead externally of the housing, or can be a plate capacitor mounted internally or externally of the housing.
申请公布号 US2002141142(A1) 申请公布日期 2002.10.03
申请号 US20010028815 申请日期 2001.12.28
申请人 AGILENT TECHNOLOGIES, INC. 发明人 ROOKES CHRISTIAN
分类号 H01L23/02;H01L23/04;H01S5/022;H01S5/042;H01S5/062;(IPC1-7):H01G4/228 主分类号 H01L23/02
代理机构 代理人
主权项
地址