发明名称 HEAT-RESISTANT RESIN COMPOSITION AND COATING
摘要 PROBLEM TO BE SOLVED: To obtain both a heat-resistant resin composition having a reduced amount of an organic solvent content, not causing the environmental pollution and deteriorating the operation environment, advantageous for safety and sanitation, having excellent characteristics of coating and coating film, and a coating comprising the resin composition as a coating film component. SOLUTION: This heat-resistant resin composition is obtained by mixing (A) a polyamide-imide resin obtained by reacting a diisocyanate compound or a diamine compound with a tribasic acid anhydride or a tribasic acid chloride in a basic polar solvent with (B) a basic compound and (C) water and the amount of the basic compound in the component (B) mixed is 1-20 equivalents based on the acid number obtained by adding the carboxy group contained in the polyamide-imide resin in the component (A) to the carboxy group obtained by subjecting the acid anhydride group in the polyamide-imide resin to ring opening.
申请公布号 JP2002284993(A) 申请公布日期 2002.10.03
申请号 JP20010138302 申请日期 2001.05.09
申请人 HITACHI CHEM CO LTD 发明人 SAOTOME TAKEHIKO;YOTSUYA SEIICHI
分类号 C08L79/08;C08K5/17;C09D179/08;H01B3/30;(IPC1-7):C08L79/08 主分类号 C08L79/08
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