发明名称 COMPOSITION FOR POROUS ORGANO POLYSILICA DIELECTRIC SUBSTANCE FORMATION
摘要 PROBLEM TO BE SOLVED: To introduce uniformly dispersed pores or voids into an insulation film so as to reduce the dielectric constant of an intermediate layer, an intermetal or an insulator of an electronic device in the production of electronic parts and to reduce an active ray reflection in exposure of photoresist. SOLUTION: This composition is useful for forming a porous organo polysilica dielectric substance and contains a removable porogen which comprises one or more chromophoric groups. The one or more chromophoric groups are selected from monomers containing phenyl, substituted phenyl, naphthyl, substituted naphthyl, anthracenyl, substituted anthracenyl, phenanthrenyl, substituted phenanthrenyl and one or more (4C-24C) alkyl groups.
申请公布号 JP2002284997(A) 申请公布日期 2002.10.03
申请号 JP20010312551 申请日期 2001.10.10
申请人 SHIPLEY CO LLC 发明人 ZAMPINI ANTHONY;GALLAGHER MICHAEL K
分类号 G03F7/004;C08F20/18;C08F230/08;C08F290/06;C08L33/04;C08L55/00;C08L83/02;C08L83/04;C09D5/32;C09D183/04;H01L21/027;H01L21/312;H01L21/316;H05K1/03;H05K3/00 主分类号 G03F7/004
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