发明名称 |
Singulation apparatus and method for manufacturing semiconductors |
摘要 |
A method and apparatus are provided for singulating semiconductor devices from a strip containing a plurality of semiconductor devices. A singulation saw chuck is also provided. The method includes the steps of making isolation cuts part way through the strip of semiconductor devices, inverting the strip onto a saw chuck with barriers that mate with the isolation cuts, and making singulation cuts that match the isolation cuts to completely separate the individual semiconductor devices.
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申请公布号 |
US2002139235(A1) |
申请公布日期 |
2002.10.03 |
申请号 |
US20020081919 |
申请日期 |
2002.02.20 |
申请人 |
NORDIN BRETT WILLIAM;MCDONALD JAMES JOSEPH |
发明人 |
NORDIN BRETT WILLIAM;MCDONALD JAMES JOSEPH |
分类号 |
B28D5/02;H01L21/00;H01L21/304;H01L21/78;(IPC1-7):B26D3/08 |
主分类号 |
B28D5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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