Lead frame, and semiconductor integrated circuit using the same, and optical module and method producing for the same

摘要

A producing method an optical module is carried out as shown below. First, an optical-communication functional portion is disposed on a lead frame where each lead is held by an insulating connection leads. A screening test for the optical communication functional portion is performed. A product selected through a screening test process is packaged. In the above-mentioned method, the connection leads which are electrically insulated with one another and the screening test is performed before packaging or encapsulating. Consequently, the waste accompanied by discarding the component elements of the optical module, which has caused an increase in the cost, can be eliminated. Further, an attempt to reduce the cost of products can also be made.