<p>An assembly (10) having a thermosetting layer (100) pierced by a plurality of conductors (300) is formed on a release sheet (200) and subsequently sandwiched between an IC and a PWB or other supporting surface and subsequently cured. The release sheet is removed either before or during curing of the thermosetting material. Removal prior to curing may be accomplished via peeling. Removal during curing may be by destruction of the layer by the curing process.</p>
申请公布号
WO02076735(A1)
申请公布日期
2002.10.03
申请号
WO2002US07010
申请日期
2002.03.07
申请人
HONEYWELL INTERNATIONAL INC.;IWAMOTO, NANCY;PEDIGO, JESSE;TISDALE, STEPHEN