发明名称 |
Circuit board and method for producing the same |
摘要 |
An etching treatment is applied to a metal plate in accordance with a predetermined circuit pattern to form a circuit. Subsequently, a sandblast treatment is applied to an entire surface including the circuit to remove a conductive reactive layer remaining at a metal-removed portion of the circuit. Accordingly, an insulating substrate as an underlying layer is exposed from the metal-removed portion of the circuit. The sandblast treatment is performed under a condition in which an Ni plating layer remains on the circuit at a stage at which the conductive reactive layer remaining at the metal-removed portion of the circuit is removed.
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申请公布号 |
US2002138973(A1) |
申请公布日期 |
2002.10.03 |
申请号 |
US20020107893 |
申请日期 |
2002.03.27 |
申请人 |
NGK INSULATORS, LTD. |
发明人 |
ISHIKAWA TAKAHIRO;KIDA MASAHIRO;ISHIKAWA SHUHEI;NAKAYAMA NOBUAKI |
分类号 |
H05K1/03;H05K3/04;H05K3/06;H05K3/20;H05K3/38;(IPC1-7):B23P19/00 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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