发明名称 MOLD FOR MOLDING RESIN
摘要 PROBLEM TO BE SOLVED: To provide a mold for molding a resin capable of uniformly and efficiently controlling the temperature in the vicinity of a mold cavity part in order to realize both of the enhancement of the accuracy of a molded product and the cost reduction due to the shortening of a molding cycle in the molding of the resin, capable of rapidly cooling the molten resin in the mold cavity and having a simple structure. SOLUTION: In the mold for molding the resin, the temperature regulation part of the whole of the mold is constituted of the temperature regulation part in the vicinity of the cavity by a heating medium and the temperature regulation part of the whole of the mold for conducting the potential heat of the heating medium in the direction of the parting surface of the mold to prevent the diffusion of heat to the whole of the mold, and the temperature regulation part in the vicinity of the cavity is formed into the core piece processed by a discharge plasma sintering method of at least one of a fixed mold and a movable mold.
申请公布号 JP2002283355(A) 申请公布日期 2002.10.03
申请号 JP20010092884 申请日期 2001.03.28
申请人 TORAY IND INC;TOYO PLASTIC SEIKO CO LTD 发明人 NISHIZAWA TAKESHI;KASAI KENJI
分类号 B29C33/38;B29C45/26;(IPC1-7):B29C33/38 主分类号 B29C33/38
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