Our wafer scale processing techniques produce chip-laser-diodes with a diffraction grating (30) that redirects output light out the top and/or bottom surfaces. Noise reflections are carefully controlled, allowing significant reduction of the signal fed to the active region (46). The improved method and structure use dry-etched shaping of at least one of an output-end of the top contact (24) and/or an output-end of the upper electrode (26). This shaping provides at least one of substantial elimination of: resonance producing reflection from the upper electrode output end (26), and light beam shaping. Preferably, both (24, 26) are shaped with one patterning.
申请公布号
WO02078141(A1)
申请公布日期
2002.10.03
申请号
WO2002US08774
申请日期
2002.03.22
申请人
INFINITE PHOTONICS, INC.;STOLTZ, RICHARD, A.;BULLINGTON, JEFF, A.