发明名称 DEVICE AND METHOD FOR LASER BEAM MACHINING
摘要 <p>PROBLEM TO BE SOLVED: To provide a laser beam machining device with which an influence of a thermal deformation upon an optical medium is decreased and a decrease in throughput is not caused. SOLUTION: A laser light source 1 emits a pulse laser beam at an input of an external trigger signal. A movable stage 20 holds and moves a workpiece on the holding plane of the stage. A beam scanning mechanism 10 makes the pulse laser beam emitted from the laser light source l incident upon the surface to be machined of the workpiece 40 held on the movable stage 20, and moves the position of incident points in a certain extent. A controlling mechanism 30 outputs the trigger signals to the laser light source at a certain time interval during the time period in which the beam scanning mechanism 10 is so controlled that the workpiece 40 held on the movable stage 20 is not irradiated with the pulse laser beam.</p>
申请公布号 JP2002283074(A) 申请公布日期 2002.10.02
申请号 JP20010092397 申请日期 2001.03.28
申请人 TOPPAN PRINTING CO LTD;SUMITOMO HEAVY IND LTD 发明人 OGAWA AKIRA;KAWANA JUN;SHUDO KAZUMASA;TANAKA KENTA
分类号 B23K26/00;B23K26/08;(IPC1-7):B23K26/00 主分类号 B23K26/00
代理机构 代理人
主权项
地址