发明名称 Interference prevention grounding mechanism
摘要 A connector interference prevention grounding mechanism comprises a circuit board with a connector on one side. The connector has a plurality of slots, each slot contains a sleeve internally. One metal board each is on top and bottom of the connector. Internal to the side slots on both end of the connector has a grounding sleeve. A C-shaped spring tongue is in the middle of the grounding sleeve. A convex point is on the bottom of the metal board and beneath the C-shaped spring tongue. Therefore by the C-shaped spring tongue of the grounding sleeve contacting the convex point of the metal board, the grounding sleeve also connects to the circuitry of the circuit board so that the electromagnetic wave and static electricity absorbed by the metal board can be conducted to the circuit board through the grounding sleeve to eliminate the electromagnetic wave and static electricity.
申请公布号 US6457982(B1) 申请公布日期 2002.10.01
申请号 US20010906089 申请日期 2001.07.17
申请人 JESS-LINK PRODUCTS CO., LTD. 发明人 KO SHENG-CHING;WEI SHIN-FU
分类号 H01R13/648;H01R13/658;(IPC1-7):H01R12/00 主分类号 H01R13/648
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