| 发明名称 |
High-frequency module, method of manufacturing thereof and method of molding resin |
| 摘要 |
A method of molding resin on a thin-film resin substrate having a first surface provided with an electronic circuit and a second unleveled surface opposite the first surface is disclosed. The method includes the steps of: a) providing deformation restricting means for the substrate; and b) molding the resin on the first surface.
|
| 申请公布号 |
US6458629(B2) |
申请公布日期 |
2002.10.01 |
| 申请号 |
US20010804035 |
申请日期 |
2001.03.13 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
KOBAYASHI KAZUHIKO |
| 分类号 |
B29C33/12;B29C45/14;B29C45/26;H01L21/56;H01L23/28;H01L23/31;H01L23/66;H05K3/28;(IPC1-7):H01L21/44 |
主分类号 |
B29C33/12 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
