发明名称 Slurry recirculation in chemical mechanical polishing
摘要 A recirculation mechanism is used to force slurry toward the center of a platen used for chemical-mechanical polishing. The recirulator captures the slurry that would otherwise be flung from a rotating platen because of centrifugal force. The captured slurry is forced upwardly away from the surface of the platen and toward the center of the platen to recycle the slurry.
申请公布号 US6458020(B1) 申请公布日期 2002.10.01
申请号 US20010683086 申请日期 2001.11.16
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 BRIGANTE JEFFREY A.;CONRAD THOMAS L.;FONTAINE DAVID J.;NADEAU ROCK;SMITH, JR. PAUL H.;VAN KESSEL THEODORE G.
分类号 B24B37/04;B24B57/02;(IPC1-7):B24B1/00 主分类号 B24B37/04
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