发明名称 |
Slurry recirculation in chemical mechanical polishing |
摘要 |
A recirculation mechanism is used to force slurry toward the center of a platen used for chemical-mechanical polishing. The recirulator captures the slurry that would otherwise be flung from a rotating platen because of centrifugal force. The captured slurry is forced upwardly away from the surface of the platen and toward the center of the platen to recycle the slurry.
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申请公布号 |
US6458020(B1) |
申请公布日期 |
2002.10.01 |
申请号 |
US20010683086 |
申请日期 |
2001.11.16 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BRIGANTE JEFFREY A.;CONRAD THOMAS L.;FONTAINE DAVID J.;NADEAU ROCK;SMITH, JR. PAUL H.;VAN KESSEL THEODORE G. |
分类号 |
B24B37/04;B24B57/02;(IPC1-7):B24B1/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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