发明名称 Plasma & reactive ion etching to prepare ohmic contacts
摘要 A method of making a low-resistance electrical contact between a metal and a layer of p-type CdTe surface by plasma etching and reactive ion etching comprising:a) placing a CdS/CdTe layer into a chamber and evacuating said chamber;b) backfilling the chamber with Argon or a reactive gas to a pressure sufficient for plasma ignition; andc) generating plasma ignition by energizing a cathode which is connected to a power supply to enable the plasma to interact argon ions alone or in the presence of a radio-frequency DC self-bias voltage with the p-CdTe surface.
申请公布号 US6458254(B2) 申请公布日期 2002.10.01
申请号 US19970937718 申请日期 1997.09.25
申请人 MIDWEST RESEARCH INSTITUTE 发明人 GESSERT TIMOTHY A.
分类号 C23C14/34;H01L21/302;H01L21/461;H01L21/465;H01L31/0224;H01L31/072;H01L31/18;(IPC1-7):H01L21/461 主分类号 C23C14/34
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